Supporting frame for surface-mount diode package

ABSTRACT

A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

This application is a division of patent application Ser. No.10/308,274, filed Dec. 3, 2002 now U.S. Pat. No. 7,095,101, which is acontinuation of application Ser. No. 09/712,664, filed Nov. 15, 2000,now abandoned.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates to semiconductor device package, particularly asurface-mount diode package.

(2) Brief Description of the Related Art

FIG. 1 shows a prior art diode package. A semiconductor diode chip 10has two bottom electrodes 101 and 102 at two ends of the chip as shownin FIG. 2, which is section view of FIG. 1 along the dotted sectionline. The electrodes 101 and 102 are attached respectively to twometallic contacts 11 and 12 by means of solder 14. These two metallicbase contacts serve as leads for surface mounting of the diode packageon a mother board The chip 10 is then covered and sealed in a glue 13.

Since the chip is supported on the two metallic base plates 11 and 12,any relative bending and twisting of the two metallic contacts may causedamage to the chip 10.

SUMMARY OF THE INVENTION

An object of this invention is to strengthen the support of a diode chipin a surface-mount package. Another object of this invention is toimprove the reliability of a diode package.

These objects are achieved by adding a supporting frame bridging the twometallic contacts. Thus any bending or twisting stress exerted betweenthe two contacts is mainly borne by the supporting frame instead of thechip, and the supporting frame is strong enough to withstand any suchbending and/or twisting stress.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 shows a prior art diode package.

FIG. 2 shows a cross section view of FIG. 1

FIG. 3 shows the base structure of the present invention with asupporting frame around the diode chip.

FIG. 4 shows the cross section view of the FIG. 3.

FIG. 5 shows a second embodiment of the present invention.

FIG. 6 shows the cross section view of FIG. 5.

FIG. 7 shows a third embodiment of the present invention.

FIG. 8 shows the cross section view of FIG. 7.

FIG. 9 shows a fourth embodiment of the present invention.

FIG. 10 shows the 3-dimensional view of the supporting frame in of FIG.9.

FIG. 11 shows a unitary structure of the supporting frame with one ofthe contacts.

FIG. 12 shows a unitary structure of the supporting frame for theembodiment shown in FIG. 6.

FIG. 13 shows a unitary structure of the supporting frame for theembodiment shown in FIG. 8.

FIG. 14 shows a conical hole in the supporting frame shown in FIG. 13

DETAILED DEACRIPTION OF THE INVENTION

FIG. 3 shows the basic structure of the present invention. A diode chip10 is mounted over two metallic contacts 21, 22, serving as leads of asurface mounting diode package. The diode chip 10 is surrounded by ametal frame 25, which is also mounted over the two metallic contacts 21,22 by solders 24.

FIG. 4 shows the cross section view of FIG. 3 along the dotted sectionline The diode chip has two bottom electrodes 101 and 102, which areconnected to the metallic contacts 21 and 22, respectively by means ofthe solder 14. The supporting frame 25 is also mounted over the twosupporting metallic frame 25 by means of solders 24. Because thesupporting frame 25 is larger than the diode chip 10 and surrounds thediode chip, any bending or twisting stress exerted between the twometallic contacts 21, 22 is withstood by the supporting frame 25 insteadof the diode chip. Thus, the diode chip is protected by the supportingframe 25.

FIG. 5 shows a second embodiment of the present invention. The diodechip 20 has two top electrodes 201, 202. The diode chip 20 is surroundedby a supporting frame 25 which is attached to two metal contacts 31 and32, serving as leads for surface mounted to a mother board. Theelectrodes 201 and 202 are connected to the two metal contacts 31 and 32respectively by means by solders 14 as shown in FIG. 6 at points 301 and302, which is a cross section view of FIG. 5 along the dotted sectionline. The supporting frame 25 cups the diode chip 20 and is hangingunder the two zigzag metallic contacts 31, 32 by means of solders 24.Since the supporting frame 25 bridges between the two metallic contacts31, 32, the supporting frame 25 prevents any bending or twisting betweenthe two metallic contacts 31, 32. As the diode chip 20 is soldered underthe zigzag metallic contacts 31, 32, the supporting frame 25 preventsany bending or twisting stress exerted to the diode.

FIG. 7 shows a third embodiment of the present invention for packaging adiode chip 30 with a single top electrode 301 and a bottom electrode.The diode chip 30 is surrounded by a supporting frame 25. The topelectrode 301 is connected to a metallic contact 41 through a lead 401for surface mounting. The bottom electrode of the diode chip isconnected to another metallic contact 42 for surface mounting. FIG. 8shows the cross section view FIG. 7 along the dotted line. The topelectrode 301 of the diode chip 30 is connected to the lead 401 of azigzag metallic plate 41 by means of the solder 14. The bottom electrode302 of the diode chip 30 is connected to the metallic contact 42 bymeans of the glue 24, which is between the metallic contact 41 and thesupporting frame 25. The supporting frame 25 is also mounted over themetallic contact 42 by means of glue 24. The supporting frame 25prevents bending or twisting stress exerted to the diode.

FIG. 9 shows a fourth embodiment of the present invention for packaginga diode chip with two top electrodes 201 and 202. The diode chip issurrounded by a supporting frame 35. The top electrode 201 is connectedto a zigzag metallic contact 31 for surface mounting through glue 14.The top electrode 202 is connected to a zigzag metallic contact forsurface mounting through another solder 14. The supporting frame 35 isalso attached to the metallic contact 31 by means of glue 24 and to themetallic contact 32 by means of another glue 24. The supporting frame 35bridges across the two metallic contacts 31 and 32 and prevents anybending or twisting stress exerted on the diode chip 20. The shape ofthe supporting frame 35 is shown in FIG. 10 showing a conical window toanchor the diode chip.

FIG. 11 shows a fifth embodiment of the present invention. A supportingframe 55 is formed over a metallic contact 51 as a cantilever in aunitary structure. The end of the cantilever is glued (not shown) to thesecond metallic contact such that the supporting frame 55 is solidlyfixed with respect to the two metallic contacts 51, 52. Thus thesupporting frame 55 bridges across the two metallic contacts 51, 52 andprevents any bending or twisting stress exerted on the diode chipanchored inside the supporting frame 55.

FIG. 12 shows a sixth embodiment of the present invention. The metalliccontacts 61 and 62 are of zigzag shape. The supporting frame 65 ishanging under the metallic contact 61. The free end of the cantilever isglued under the second metallic contact 62. Thus the supporting frame 65is solidly fixed with respect to the two metallic contacts 61, 62 andprevents any bending or twisting stress exerted on the diode chipanchored inside the supporting frame 65.

FIG. 13 shows a seventh embodiment of the present invention. Thesupporting frame 75 is formed as a pedestal to the left of the metalliccontact 72. The left end of the supporting frame 75 is glued under azigzag metallic contact 71. Thus the supporting frame 75 is solidlyfixed with respect to the two metallic contacts 71, 72 and prevents anybending or twisting stress exerted on the diode chip anchored inside acircular window of the supporting frame 75.

FIG. 14 shows an eighth embodiment of the present invention. Thestructure is similar to that in shown in FIG. 13, except that the windowof the supporting frame 85 is of conical shape. As in FIG. 13, thesupporting frame forms a pedestal over the metallic contact 82 and isglued on top to another metallic contact 81.

While the preferred embodiments of the invention have been described, itwill be apparent to those skilled in the art that various modificationsmay be made in the embodiments without departing from the spirit of thepresent invention. Such modifications are all within the scope of thisinvention.

1. A surface mount diode package, comprising: diode chip having a firstelectrode and a second electrode on same surface; a first metalliccontact coupled by soldering to said first electrode for surfacemounting; a second metallic contact coupled by soldering to said secondelectrode and in line with said first metallic contact for surfacemounting; a supporting frame surrounding said diode chip and solidlybridging between said first metallic contact and said second metalliccontact to prevent bending of said diode chip, wherein both of saidfirst metallic contact and said second metallic contact are of zigzagshape.
 2. The surface mount diode package as claimed in claim 1, whereinthe window of said supporting frame is of circular shape.
 3. The surfacemount diode package as described in claim 1, wherein the window of saidsupporting frame is of conical shape.
 4. The surface mount diode packageas described in claim 1, wherein said supporting frame is integratedwith one of said metallic contact.